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MAJOR
EQUIPMENT
- Thin Film Deposition: Molecular Beam Epitaxy,
two thermal evaporators, a four-hearth electron beam
evaporator, four sputter systems, a plasma-enhanced chamical
vapor deposition chamber, and four low-pressure chemical vapor
deposition tube furnaces.
- Dry Etching: A reactive ion etching chamber
for metals and compound semiconductors, a reactive ion
etching chamber for dielectrics and silicon, an ion milling
system, and a barrel reactor for plasma etching.
- Photolithography: A projection stepper system,
two contact mask aligners, photoresist spinners for both
circular and variable-geometry substrates, CAD equipment
for mask design, and a photomask plate maker.
- Thermal Processing: A rapid thermal anneal system,
ten tube furnaces for annealing and oxidation and an
environmental testing chamber.
- Packaging: Wedge and ball bonders two semi-transparent
furnaces for encapsulation, and wafer dicing and scribing
equipment.
- Analytical Equipment: A combined near-field/atomic
force microscope, a scanning electron microscope with an
energy dispersive X-ray analyzer, ellipsometer, and surface
profilometer.
In addition, the MML is supported by various material
and device characterization facilities which are located in
the same wing of the Engineering Gateway Building but external
to the cleanroom area. The material characterization equipment
includes Hall-effect, Photoluminescence, the Photoreflectance
analyzers; the device characterization equipment includes a
semiconductor parameter analyzer, a network analyzer, a
microwave S-parameter analyzer and a variety of spectrum,
noise, and impedance analyzers. Also available is an automated
He refrigerator cryogenic station, vibration-isolated opeical
benches, and a variety of laser sources (HeNe, Argon, Tunable
Dye, YAG, and GaAs diode).
EQUIPMENT I
NVENTORY (OCTOBER, 1996)
Sample Preparation
- Buhler Isomet 11-1180-160 Low Speed Saw
- K&S 750 Scriber
- Raytheon Model 100 Ultrasonic Impact Grinder
- Metals Research LTD. Multipol 2 Polisher
Thin Film Deposition
- Varian Gen II Molecular Beam Epitaxy [combined (III-V)-IV capability]
- Varian 3118 Thermal Evaporator with IC6000 Thickness monitor
- Veeco V-300 Thermal Evaporator with Sloan Thicness Monitor
- Airco/Temescal CV-8 Four-hearth Electron Beam Evaporator with IC6000
- Plasma-Therm Model 790 PECVD/RIE System [dielectrics]
- Materials Research Corp. 8632 RF Sputter System
- Sloan SL1800 Sputter-Gun System
- Perkin-Elmer 2400-8L DC & RF Sputter System [three target + etch]
- Varian 4130 S-gun Sputter System with EC6000
- (2 ea.) Thermco 6" dia. four-tube furnaces with Tylan
gas controllers [annealing, oxidation, and LPCVD of oxide,
nitride, and polysilicon]
- Ion Tech Secondary Ion Reactive Sputtering/Ion Milling System
Dry Etching
- Applied Materials Model 8130 RIE System [metals & compound semiconductors]
- Plasma-Therm Model 790 PECVD/RIE system [dielectrics]
- Ion Tech Ion Mill
- Ion Tech Secondary Ion Reactive Sputtering/Ion Milling System
- Branson/IPC PM-1813 Barrel Reactor [PR ashing]
Wet Etching
Thermal Processing
- AG Heatpulse 2146 Rapid Thermal Anneal/Oxidation System
- Thermco 6" dia. four-tube furnace stacks with Tylan gas
controllers [annealing, oxidation, and APCVD of oxide, nitride, and
polysilicon] (2 ea.)
- TranTemp 2" dia. tube furnace (2 ea.)
- Cincinnati Sub-Zero environmental testing chamber
- Lindberg 5" Dia. Crucible Furnace
- Lindberg 3" Dia. Tube Furnace
Photolithography & Mask Making
- Ultratech 1000 Wide Field Projection Stepper System
- Karl Suss MJB3 Contact Aligner (2 ea.)
- Machine Technology Inc. Wafer Track Spin/Bake System [4" wafers]
- Headway Wafer Spinner
- Ultratech Model 602 Plate Cleaner
- 20:1 Mask Reduction Camer A
- GCA/David Mann Photorepeater Mask Plate system
Packaging
- K&S 4123 Wedge Bonder
- K&S 4123/4124 Wedge/Ball Bonder
- Micro Automation 1006A Wafer Dicing Saw
- Ultro Tech High Speed Dicing Saw
Analytical Equipment
- Topometrix Near-Field & Atomic Force Microscope System
- ISI SR-50A Scanning Electron Microscope with EDS
- Optical Microscopes [Leitz Secolux with MPV-SP CCD camera; Leitz
SM-Lux HL; Nikon Optiphot with Polaroid camera; Olympus MS with CCD camera]
- Rudolph Auto E1 Ellipsometer
- Tencor Alpha-Step 200 surface Profilometer
- Tektronix 576 Curve Tracer with probe system
- Veeco FPP5000 Four Point Probe
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